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Who We Are

pcb-manufacturer

A-TECH Circuits Co., Limited is an outstanding China PCB (Printed circuit board) manufacturer, Which specialize in fast PCB prototype, small to medium volume PCB manufacturing and PCB assembly services. It was founded in 2003, with more than 550 highly trained full-time employees... 


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What We Produce

PCB-manufacturing

  1. Standard Rigid FR4 PCB(1-40Layers)
  2. Flexible PCB(Include Rigid-flex PCB)
  3. Metal Core PCB(Aluminium PCB/LED PCB)
  4. Microwave / RF PCB(Include Rogers PCB, Taconic PCB, Arlon PCB, Ceramic PCB, PTFE PCB, Teflon PCB etc.)
  5. HDI PCB(1+N+1, 2+N+2)
  6. PCB Assembly

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Why Choose US

pcb-fabrication

  1. Fastest turn on PCB prototype cycle
  2. 100% In accordance with IPC-6012 & IPC-A-600; ISO9001-2008 certificate and UL Approval(UL No. E357001)
  3. Free engineering review and support
  4. Advanced PCB equipment/fabrication
  5. Extremely fast response time
  6. More competitive pricing    

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Capability

Rigid PCB Capability

Rigid PCB Capability

No

Item

Technical data

1

Number of Layers

1-40Layers

2

Max.Board Size

508*610mm

3

Board thickness

0.2-5.0mm

4

Min Line Width/Space

4mil/4mil(0.1/0.1mm)

5

Min.S/M Pitch

0.1mm(4mil)

6

Finish Drill Hole (Mechanical)

0.2mm--6.30mm

7

PTH Wall Thickness

>0.020mm(0.8mil)

8

Hole Dia.Tolerance(PTH)

±0.075mm(3mil)

9

Hole Dia.Tolerance(NPTH)

±0.05mm (2mil)

10

Hole Position Deviation

±0.05mm (2mil)

11

Outline Tolerance

±0.10mm (4mil)

12

Twist&Bow

≤0.7%

13

Insulation Resistance

>1012Ω Normal

14

Through hole resistance

<300Ω Normal

15

Electric strength

>1.3 kv/mm

16

Current breakdown

10A

17

Peel strength

1.4N/mm

18

S/M abrasion

>6H

19

Thermal stress

288℃ 20 Sec

20

Test Voltage

50-300V

21

Min. blind/buried via

0.2mm/0.2mm(Mechanical)

0.1mm/0.2mm(Laser)

22

Available Laminates Material

CEM1, CEM3, FR-4, High-Tg FR4, Aluminum Base, Rogers, Taconic, Arlon etc.

23

Finished board thickness tolerance

T>=0.8mm, Tolerance: +/-8%, T<0.8mm : +/-10%

24

Out Layer Copper Thickness

1oz--6oz

25

Inner Layer Copper Thickness

1/2oz--4oz

26

Aspect Ratio

15:1

27

SMT Mini. Solder Mask Width

0.08mm

28

Mini. Solder Mask Clearance

0.05mm

29

Plug Hole Diameter

0.2mm--0.60mm

30

Impedance Control Tolerance

+/-10%

31

Surface Finish

HASL,HAL（Lead free）,Immersion Gold/Tin/Silver，Gold Plated, OSP, Gold Finger, Peelable mask

32

Insulation Layer Thickness

0.075mm--5.00mm

33

Special technology

Thick hard gold plating, Via in Pad, Counterbore&Countersunk etc.

Flexible PCB Capability

Flexible PCB Capability

No

Item

Technical data

1

Number of layers

Flex: 1~6layer

Rigid/flex: 2-10layer

2

Min trace Width/Spacing

12 & 18um (base Cu): 0.075/0.075mm

35um (base Cu): 0.1/0.1mm

3

Min Space Between Coverlay Openings

0.2mm

4

Edge of Coverlay Opening to Trace

0.20mm(preferred)

5

Min Space between coverlay & solder pad

0.15mm

6

Polyimide Films

0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils (100µ) as custmer requested.

7

Thermobond Adhesives

Acrylic/Modified Acrylic, Modified Epoxy, Polyimide

8

Copper Foils (RA or ED)

1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)

9

Stiffeners

Polyimide, rigid FR4, PSA, metal, etc.

10

FR-4 in Multi-layer Flex Circuits

Laminated to flex circuit to create rigid flex boards, typically with vias.

11

Surface Finish

Electroless Ni/Au, Electrolytic soft/hard gold,

Tin plating, Imm.Tin, Entek/OSP

12

Solder Resists

Coverlay, Photo-Imagable Resist

13

Hole tolerance

±0.05mm

14

Smallest Drill Size

0.2mm

15

Largest Drill Size

6.35mm

16

Smallest Slot Width

0.35mm

17

Min.spacing between holes

0.15mm

18

Minimum conductor edge to outline edge

≥0.1mm

19

Min Spacing between coverlay & conductor

± 0.15mm

20

Hole to outline edge

≥ 0.10mm

21

Max Layer to Layer Mis-registration

± 0.10mm

22

Tooling tolerances

Steel(Hard) tooling : ± 0.05mm

CNC drill/rout : ± 0.10mm

Knife(Soft) tooling : ± 0.25mm

23

Copper Plated Thickness (PTH only)

8~15um; 20~30um; 30~70um(special)

24

Au thickness

Electroless: Ni/Au   Ni: 2~6um;Au:0.035~0.075um     

Electrolytic soft/hard gold Ni: 2~9um;Au: 0.035~0.1um

Metal Core PCB Capability

 Metal Core PCB Capability 

No

Item

Technical data

1

Number of Layers

1-2Layers

2

Material

Aluminum / Copper base

3

Final Thickness

0.5-3.0mm

4

Max Size

1200mm x 600mm

5

Insulating Layer Thickness

50, 75, 100, 125, 150micron

6

Min trace Width/Spacing

6mil/6mil(0.15/0.15mm)

7

Copper Thickness

0.5oz-3oz

8

Min hole size

0.6mm

9

Thermal Conductivity

1.0-4.0W/m.K

10

Aluminum Type

3003, 5052, 6061 etc.

11

Breakdown voltage

2-8KV

12

Min Solder Dam

4mil

13

Min Hole Ring

4mil

14

Twist&Bow

≤0.7%

15

Test Voltage

50-300V

16

Solder Mask Colour

White, Black, Red, Green, Blue, Yellow

17

Silkscreen colour

White, Black

18

Tolerance of Profile

+/-5mil

19

Peel Strength

≥ 1.8 N/MM

20

Surface Resistance

≥ 1*105 M

21

Permittivity

≤ 4.4

22

Disspation Factor

≤ 0.03

23

Surface Treatment

HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating

Manufacturing Lead Time

As a quick turn PCB manufacturer, We fully understand short and accurate lead time is essential in today's rapidly changing market place. Customers need to know the exact date of the PCBs delivery so they can prepare the project schedules ahead of time.

The fabrication of quick turn PCB prototype is our characteristic service with great advantages, no matter for pricing or lead time, we could even provide 24-Hour quick turn PCB prototype manufacturing service if needed, normally our standard lead time for small & middle volume PCB starts from 8 to 15 working days, for quick turn PCB prototype, the fastest and standard lead time is listed as below,

Layer Fastest Lead Time Standard Lead Time
2 24 Hours 4 WD
4 48 Hours 5 WD
6 3 WD 6 WD
8 3 WD 7 WD
10 3 WD 8 WD
12 4 WD 8 WD
14 4 WD 9 WD
≥16 Up to difficulty Up to difficulty